• Jarod Wilson's avatar
    bonding: allow xfrm offload setup post-module-load · a3b658cf
    Jarod Wilson authored
    At the moment, bonding xfrm crypto offload can only be set up if the bonding
    module is loaded with active-backup mode already set. We need to be able to
    make this work with bonds set to AB after the bonding driver has already
    been loaded.
    
    So what's done here is:
    
    1) move #define BOND_XFRM_FEATURES to net/bonding.h so it can be used
    by both bond_main.c and bond_options.c
    2) set BOND_XFRM_FEATURES in bond_dev->hw_features universally, rather than
    only when loading in AB mode
    3) wire up xfrmdev_ops universally too
    4) disable BOND_XFRM_FEATURES in bond_dev->features if not AB
    5) exit early (non-AB case) from bond_ipsec_offload_ok, to prevent a
    performance hit from traversing into the underlying drivers
    5) toggle BOND_XFRM_FEATURES in bond_dev->wanted_features and call
    netdev_change_features() from bond_option_mode_set()
    
    In my local testing, I can change bonding modes back and forth on the fly,
    have hardware offload work when I'm in AB, and see no performance penalty
    to non-AB software encryption, despite having xfrm bits all wired up for
    all modes now.
    
    Fixes: 18cb261a ("bonding: support hardware encryption offload to slaves")
    Reported-by: default avatarHuy Nguyen <huyn@mellanox.com>
    CC: Saeed Mahameed <saeedm@mellanox.com>
    CC: Jay Vosburgh <j.vosburgh@gmail.com>
    CC: Veaceslav Falico <vfalico@gmail.com>
    CC: Andy Gospodarek <andy@greyhouse.net>
    CC: "David S. Miller" <davem@davemloft.net>
    CC: Jeff Kirsher <jeffrey.t.kirsher@intel.com>
    CC: Jakub Kicinski <kuba@kernel.org>
    CC: Steffen Klassert <steffen.klassert@secunet.com>
    CC: Herbert Xu <herbert@gondor.apana.org.au>
    CC: netdev@vger.kernel.org
    CC: intel-wired-lan@lists.osuosl.org
    Signed-off-by: default avatarJarod Wilson <jarod@redhat.com>
    Signed-off-by: default avatarDavid S. Miller <davem@davemloft.net>
    a3b658cf
bonding.h 20.2 KB