selftests/xsk: Enhance batch size support with dynamic configurations
Introduce dynamic adjustment capabilities for fill_size and comp_size parameters to support larger batch sizes beyond the previous 2K limit. Update HW_SW_MAX_RING_SIZE test cases to evaluate AF_XDP's robustness by pushing hardware and software ring sizes to their limits. This test ensures AF_XDP's reliability amidst potential producer/consumer throttling due to maximum ring utilization. Signed-off-by: Tushar Vyavahare <tushar.vyavahare@intel.com> Signed-off-by: Daniel Borkmann <daniel@iogearbox.net> Reviewed-by: Maciej Fijalkowski <maciej.fijalkowski@intel.com> Link: https://lore.kernel.org/bpf/20240702055916.48071-3-tushar.vyavahare@intel.com
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