- 21 Apr, 2021 2 commits
-
-
Rafał Miłecki authored
This helps validating DTS files. Signed-off-by:
Rafał Miłecki <rafal@milecki.pl> Reviewed-by:
Rob Herring <robh@kernel.org> Signed-off-by:
Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210420210104.10555-1-zajec5@gmail.com
-
Lin Ruizhe authored
The function ti_bandgap_restore_ctxt() restores the context at resume time. It checks if the sensor has a counter, reads the register but does nothing with the value. The block was probably omitted by the commit b87ea759. Remove the unused variable as well as the block using it as we can consider it as dead code. Reported-by:
Hulk Robot <hulkci@huawei.com> Fixes: b87ea759 ("staging: omap-thermal: fix context restore function") Signed-off-by:
Lin Ruizhe <linruizhe@huawei.com> Reviewed-by:
Tony Lindgren <tony@atomide.com> Tested-by:
-
- 20 Apr, 2021 8 commits
-
-
Rafał Miłecki authored
This property is required for every thermal sensor as it's used when using phandles. Signed-off-by:
-
Zhen Lei authored
For the sake of lisibility, reorder the header files alphabetically. Signed-off-by:
Zhen Lei <thunder.leizhen@huawei.com> Reviewed-by:
Keerthy <j-keerthy@ti.com> Signed-off-by:
-
dingsenjie authored
Use the devm_platform_ioremap_resource_byname() helper instead of calling platform_get_resource_byname() and devm_ioremap_resource() separately. Signed-off-by:
dingsenjie <dingsenjie@yulong.com> Signed-off-by:
-
Ye Bin authored
There is a error message within devm_ioremap_resource already, so remove the dev_err call to avoid redundant error message. Reported-by:
Ye Bin <yebin10@huawei.com> Signed-off-by:
-
Zhang Rui authored
On Intel processors, the core frequency can be reduced below OS request, when the current temperature reaches the TCC (Thermal Control Circuit) activation temperature. The default TCC activation temperature is specified by MSR_IA32_TEMPERATURE_TARGET. However, it can be adjusted by specifying an offset in degrees C, using the TCC Offset bits in the same MSR register. This patch introduces a cooling devices driver that utilizes the TCC Offset feature. The bigger the current cooling state is, the lower the effective TCC activation temperature is, so that the processors can be throttled earlier before system critical overheats. Note that, on different platforms, the behavior might be different on how fast the setting takes effect, and how much the CPU frequency is reduced. This patch has been tested on a KabyLake mobile platform from me, and also on a CometLake platform from Doug. Signed-off-by:
Zhang Rui <rui.zhang@intel.com> Tested by: Doug Smythies <dsmythies@telus.net> Signed-off-by:
-
Ruiqi Gong authored
There is a error message within devm_ioremap_resource already, so remove the dev_err call to avoid redundant error message. Reported-by:
Ruiqi Gong <gongruiqi1@huawei.com> Signed-off-by:
-
Ruiqi Gong authored
There is a error message within devm_ioremap_resource already, so remove the dev_err call to avoid redundant error message. Reported-by:
Talel Shenhar <talel@amazon.com> Signed-off-by:
-
Konrad Dybcio authored
MDM9607 TSENS IP is very similar to the one of MSM8916, with minor adjustments to various tuning values. Signed-off-by:
Konrad Dybcio <konrad.dybcio@somainline.org> Acked-by:
Thara Gopinath <thara.gopinath@linaro.org> Signed-off-by:
-
- 15 Apr, 2021 10 commits
-
-
Robert Foss authored
Add tsens bindings for sm8350. Signed-off-by:
Robert Foss <robert.foss@linaro.org> Reviewed-by:
Vinod Koul <vkoul@kernel.org> Acked-by:
Bjorn Andersson <bjorn.andersson@linaro.org> Signed-off-by:
-
Guangqing Zhu authored
Fixes coccicheck error: drivers/thermal/qcom/tsens.c:759:4-10: ERROR: missing put_device; call of_find_device_by_node on line 715, but without a corresponding object release within this function. Fixes: a7ff8297 ("drivers: thermal: tsens: Merge tsens-common.c into tsens.c") Signed-off-by:
Guangqing Zhu <zhuguangqing83@gmail.com> Reviewed-by:
-
Lukasz Luba authored
Update maintainers responsible for CPU cooling on Arm side. Signed-off-by:
Lukasz Luba <lukasz.luba@arm.com> Acked-by:
Viresh Kumar <viresh.kumar@linaro.org> Acked-by:
Javi Merino <javi.merino@kernel.org> Signed-off-by:
-
David Collins authored
Add support for TEMP_ALARM GEN2 PMIC peripherals with digital major revision 1. This revision utilizes a different temperature threshold mapping than earlier revisions. Signed-off-by:
David Collins <collinsd@codeaurora.org> Signed-off-by:
Guru Das Srinagesh <gurus@codeaurora.org> Reviewed-by:
Stephen Boyd <sboyd@kernel.org> Signed-off-by:
-
brian-sy yang authored
Slab OOB issue is scanned by KASAN in cpu_power_to_freq(). If power is limited below the power of OPP0 in EM table, it will cause slab out-of-bound issue with negative array index. Return the lowest frequency if limited power cannot found a suitable OPP in EM table to fix this issue. Backtrace: [<ffffffd02d2a37f0>] die+0x104/0x5ac [<ffffffd02d2a5630>] bug_handler+0x64/0xd0 [<ffffffd02d288ce4>] brk_handler+0x160/0x258 [<ffffffd02d281e5c>] do_debug_exception+0x248/0x3f0 [<ffffffd02d284488>] el1_dbg+0x14/0xbc [<ffffffd02d75d1d4>] __kasan_report+0x1dc/0x1e0 [<ffffffd02d75c2e0>] kasan_report+0x10/0x20 [<ffffffd02d75def8>] __asan_report_load8_noabort+0x18/0x28 [<ffffffd02e6fce5c>] cpufreq_power2state+0x180/0x43c [<ffffffd02e6ead80>] power_actor_set_power+0x114/0x1d4 [<ffffffd02e6fac24>] allocate_power+0xaec/0xde0 [<ffffffd02e6f9f80>] power_allocator_throttle+0x3ec/0x5a4 [<ffffffd02e6ea888>] handle_thermal_trip+0x160/0x294 [<ffffffd02e6edd08>] thermal_zone_device_check+0xe4/0x154 [<ffffffd02d351cb4>] process_one_work+0x5e4/0xe28 [<ffffffd02d352f44>] worker_thread+0xa4c/0xfac [<ffffffd02d360124>] kthread+0x33c/0x358 [<ffffffd02d289940>] ret_from_fork+0xc/0x18 Fixes: 371a3bc7 ("thermal/drivers/cpufreq_cooling: Fix wrong frequency converted from power") Signed-off-by:
brian-sy yang <brian-sy.yang@mediatek.com> Signed-off-by:
Michael Kao <michael.kao@mediatek.com> Reviewed-by:
-
Hao Fang authored
s/Hisilicon/HiSilicon/g. It should use capital S, according to https://www.hisilicon.com/en/terms-of-use. Signed-off-by:
Hao Fang <fanghao11@huawei.com> Signed-off-by:
-
Konrad Dybcio authored
Add the compatible for MDM9607. Signed-off-by:
-
Daniel Lezcano authored
When the function successfully finishes it logs an information about the registration of the cooling device and use its name to build the message. Unfortunately it was freed right before: drivers/thermal/cpuidle_cooling.c:218 __cpuidle_cooling_register() warn: 'name' was already freed. Fix this by freeing after the message happened. Fixes: 6fd1b186 ("thermal/drivers/cpuidle_cooling: Use device name instead of auto-numbering") Reported-by:
Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by:
-
Daniel Lezcano authored
The following error is reported by kbuild: smatch warnings: drivers/thermal/devfreq_cooling.c:433 of_devfreq_cooling_register_power() warn: passing zero to 'ERR_PTR' Fix the error code by the setting the 'err' variable instead of 'cdev'. Fixes: f8d354e8 ("thermal/drivers/devfreq_cooling: Use device name instead of auto-numbering") Reported-by:
kernel test robot <lkp@intel.com> Reported-by:
-
Daniel Lezcano authored
Fix the following error: smatch warnings: drivers/thermal/thermal_core.c:1020 __thermal_cooling_device_register() warn: possible memory leak of 'cdev' by freeing the cdev when exiting the function in the error path. Fixes: 58483761 ("thermal/drivers/core: Use a char pointer for the cooling device name") Reported-by:
-
- 19 Mar, 2021 1 commit
-
-
Thara Gopinath authored
Add myself as the maintainer for Qualcomm tsens drivers so that I can help Daniel by taking care of/reviewing changes to these drivers. Signed-off-by:
-
- 17 Mar, 2021 1 commit
-
-
Konrad Dybcio authored
The sensor *is* in fact used and does report temperature. Signed-off-by:
-
- 16 Mar, 2021 1 commit
-
-
jeson.gao authored
The division is used directly in re-divvying up power, the decimal part will be discarded, devices will get less than the extra_actor_power - 1. if using round the division to make the calculation more accurate. For example: actor0 received more than its max_power, it has the extra_power 759 actor1 received less than its max_power, it require extra_actor_power 395 actor2 received less than its max_power, it require extra_actor_power 365 actor1 and actor2 require the total capped_extra_power 760 using division in re-divvying up power actor1 would actually get the extra_actor_power 394 actor2 would actually get the extra_actor_power 364 if using round the division in re-divvying up power actor1 would actually get the extra_actor_power 394 actor2 would actually get the extra_actor_power 365 Signed-off-by:
Jeson Gao <jeson.gao@unisoc.com> Reviewed-by:
-
- 15 Mar, 2021 5 commits
-
-
Daniel Lezcano authored
There is a list with the purpose of grouping the cpufreq cooling device together as described in the comments but actually it is unused, the code evolved since 2012 and the list was no longer needed. Delete the remaining unused list related code. Signed-off-by:
-
Daniel Lezcano authored
Currently the naming of a cooling device is just a cooling technique followed by a number. When there are multiple cooling devices using the same technique, it is impossible to clearly identify the related device as this one is just a number. For instance: thermal-idle-0 thermal-idle-1 thermal-idle-2 thermal-idle-3 etc ... The 'thermal' prefix is redundant with the subsystem namespace. This patch removes the 'thermal prefix and changes the number by the device name. So the naming above becomes: idle-cpu0 idle-cpu1 idle-cpu2 idle-cpu3 etc ... Signed-off-by:
-
Daniel Lezcano authored
Currently the naming of a cooling device is just a cooling technique followed by a number. When there are multiple cooling devices using the same technique, it is impossible to clearly identify the related device as this one is just a number. For instance: thermal-devfreq-0 thermal-devfreq-1 etc ... The 'thermal' prefix is redundant with the subsystem namespace. This patch removes the 'thermal' prefix and changes the number by the device name. So the naming above becomes: devfreq-5000000.gpu devfreq-1d84000.ufshc etc ... Signed-off-by:
-
Daniel Lezcano authored
Currently the naming of a cooling device is just a cooling technique followed by a number. When there are multiple cooling devices using the same technique, it is impossible to clearly identify the related device as this one is just a number. For instance: thermal-cpufreq-0 thermal-cpufreq-1 etc ... The 'thermal' prefix is redundant with the subsystem namespace. This patch removes the 'thermal' prefix and changes the number by the device name. So the naming above becomes: cpufreq-cpu0 cpufreq-cpu4 etc ... Signed-off-by:
-
Daniel Lezcano authored
We want to have any kind of name for the cooling devices as we do no longer want to rely on auto-numbering. Let's replace the cooling device's fixed array by a char pointer to be allocated dynamically when registering the cooling device, so we don't limit the length of the name. Rework the error path at the same time as we have to rollback the allocations in case of error. Tested with a dummy device having the name: "Llanfairpwllgwyngyllgogerychwyrndrobwllllantysiliogogogoch" A village on the island of Anglesey (Wales), known to have the longest name in Europe. Signed-off-by:
Ido Schimmel <idosch@nvidia.com> Link: https://lore.kernel.org/r/20210314111333.16551-1-daniel.lezcano@linaro.org
-
- 11 Mar, 2021 1 commit
-
-
Colin Ian King authored
There is a spelling mistake in a comment, fix it. Signed-off-by:
Colin Ian King <colin.king@canonical.com> Signed-off-by:
-
- 10 Mar, 2021 7 commits
-
-
Niklas Söderlund authored
When adding support for V3U (r8a779a0) it was incorrectly recorded it supports four nodes, while in fact it supports five. The fifth node is named TSC0 and breaks the existing naming schema starting at 1. Work around this by separately defining the reg property for V3U and others. Restore the maximum number of nodes to three for other compatibles as it was before erroneously increasing it for V3U. Fixes: d7fdfb65 ("dt-bindings: thermal: rcar-gen3-thermal: Add r8a779a0 support") Signed-off-by:
Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by:
Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by:
-
Jia-Ju Bai authored
When kcalloc() returns NULL to __tcbp or of_count_phandle_with_args() returns zero or -ENOENT to count, no error return code of thermal_of_populate_bind_params() is assigned. To fix these bugs, ret is assigned with -ENOMEM and -ENOENT in these cases, respectively. Fixes: a92bab89 ("of: thermal: Allow multiple devices to share cooling map") Reported-by:
TOTE Robot <oslab@tsinghua.edu.cn> Signed-off-by:
Jia-Ju Bai <baijiaju1990@gmail.com> Signed-off-by:
-
Zhang Yunkai authored
'of_device.h' included in 'ti-bandgap.c' is duplicated. It is also included in the 25th line. Signed-off-by:
Zhang Yunkai <zhang.yunkai@zte.com.cn> Signed-off-by:
-
Niklas Söderlund authored
Add support for up to five TSC nodes. The new THCODE values are taken from the example in the datasheet. Signed-off-by:
-
Bhaskar Chowdhury authored
s/calibartion/calibration/ s/undocummented/undocumented/ Signed-off-by:
Bhaskar Chowdhury <unixbhaskar@gmail.com> Signed-off-by:
-
Bhaskar Chowdhury authored
s/calibaration/calibration/ Signed-off-by:
-
Tang Bin authored
The function devm_platform_ioremap_resource has already contains error message, so remove the redundant dev_err here. Signed-off-by:
Tang Bin <tangbin@cmss.chinamobile.com> Signed-off-by:
-
- 06 Mar, 2021 4 commits
-
-
Linus Torvalds authored
-
git://git.kernel.org/pub/scm/linux/kernel/git/rdma/rdmaLinus Torvalds authored
Pull rdma fixes from Jason Gunthorpe: "Nothing special here, though Bob's regression fixes for rxe would have made it before the rc cycle had there not been such strong winter weather! - Fix corner cases in the rxe reference counting cleanup that are causing regressions in blktests for SRP - Two kdoc fixes so W=1 is clean - Missing error return in error unwind for mlx5 - Wrong lock type nesting in IB CM" * tag 'for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/rdma/rdma: RDMA/rxe: Fix errant WARN_ONCE in rxe_completer() RDMA/rxe: Fix extra deref in rxe_rcv_mcast_pkt() RDMA/rxe: Fix missed IB reference counting in loopback RDMA/uverbs: Fix kernel-doc warning of _uverbs_alloc RDMA/mlx5: Set correct kernel-doc identifier IB/mlx5: Add missing error code RDMA/rxe: Fix missing kconfig dependency on CRYPTO RDMA/cm: Fix IRQ restore in ib_send_cm_sidr_rep -
git://git.kernel.org/pub/scm/linux/kernel/git/kees/linuxLinus Torvalds authored
Pull gcc-plugins fixes from Kees Cook: "Tiny gcc-plugin fixes for v5.12-rc2. These issues are small but have been reported a couple times now by static analyzers, so best to get them fixed to reduce the noise. :) - Fix coding style issues (Jason Yan)" * tag 'gcc-plugins-v5.12-rc2' of git://git.kernel.org/pub/scm/linux/kernel/git/kees/linux: gcc-plugins: latent_entropy: remove unneeded semicolon gcc-plugins: structleak: remove unneeded variable 'ret'
-
git://git.kernel.org/pub/scm/linux/kernel/git/kees/linuxLinus Torvalds authored
Pull pstore fixes from Kees Cook: - Rate-limit ECC warnings (Dmitry Osipenko) - Fix error path check for NULL (Tetsuo Handa) * tag 'pstore-v5.12-rc2' of git://git.kernel.org/pub/scm/linux/kernel/git/kees/linux: pstore/ram: Rate-limit "uncorrectable error in header" message pstore: Fix warning in pstore_kill_sb()
-
