The functions thermal_of_zone_register() and
thermal_of_zone_unregister() are no longer needed from the drivers as
the devm_ variant is always used.

Make them static in the C file and remove their declaration from thermal.h
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230404075138.2914680-2-daniel.lezcano@linaro.org

The driver is using the devm_thermal_of_zone_device_register().

In the error path of the function calling
devm_thermal_of_zone_device_register(), the function
devm_thermal_of_zone_unregister() should be called instead of
thermal_of_zone_unregister(), otherwise this one will be called twice
when the device is freed.

The same happens for the remove function where the devm_ guarantee the
thermal_of_zone_unregister() will be called, so adding this call in
the remove function will lead to a double free also.

Use devm_ variant in the error path of the probe function.

Remove thermal_of_zone_unregister() in the remove function.

Cc: Florian Fainelli <f.fainelli@gmail.com>
Cc: Ray Jui <rjui@broadcom.com>
Cc: Scott Branden <sbranden@broadcom.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230404075138.2914680-1-daniel.lezcano@linaro.org

Add MT8195 AP Domain support to LVTS Driver.

Take the opportunity to update the comments to show calibration data
information related to the new domain.

[dlezcano]: Massaged a bit the changelog
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Tested-by: Chen-Yu Tsai <wenst@chromium.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230307154524.118541-3-bchihi@baylibre.com

Add AP Domain to LVTS thermal controllers dt-binding definition for mt8195.
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Tested-by: Chen-Yu Tsai <wenst@chromium.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230307154524.118541-2-bchihi@baylibre.com

Replace the open-code with dev_err_probe() to simplify the code.
Signed-off-by: Ye Xingchen <ye.xingchen@zte.com.cn>
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/202303241020110014476@zte.com.cn

The binary representation for sensor 1 interrupt status was incorrectly
assembled, when compared to the full table given in the same comment
section. The conversion into hex was also incorrect, leading to
incorrect interrupt status bitmask for sensor 1. This would cause the
driver to incorrectly identify changes for sensor 1, when in fact it
was sensor 0, or a sensor access time out.

Fix the binary and hex representations in the comments, and the actual
bitmask macro.

Fixes: f5f633b1 ("thermal/drivers/mediatek: Add the Low Voltage Thermal Sensor driver")
Signed-off-by: Chen-Yu Tsai <wenst@chromium.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230328031017.1360976-1-wenst@chromium.org

Commit 32a7a021 ("thermal/core: Relocate the traces definition in
thermal directory") moves include/trace/events/thermal_power_allocator.h to
drivers/thermal/thermal_trace_ipa.h, but misses to adjust the file
entry for the THERMAL/POWER_ALLOCATOR section.

Hence, ./scripts/get_maintainer.pl --self-test=patterns complains about a
broken reference.

Adjust this file entry in THERMAL/POWER_ALLOCATOR.
Signed-off-by: Lukas Bulwahn <lukas.bulwahn@gmail.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230328091737.6785-1-lukas.bulwahn@gmail.com

Cleanup bindings dropping unneeded quotes. Once all these are fixed,
checking for this can be enabled in yamllint.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230327170233.4109156-1-robh@kernel.org

Remove struct thermal_bind_params because no one is using it for thermal
binding now.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230330104526.3196-1-rui.zhang@intel.com

Thermal zones located in power domains may not be accessible when
the domain is powergated. In this situation, reading the temperature
will return -BPMP_EFAULT. When evaluating trips, BPMP will internally
use -256C as the temperature for offline zones.

For smooth operation, for offline zones, return -EAGAIN when reading
the temperature and allow registration of zones even if they are
offline during probe.
Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230330094904.2589428-1-cyndis@kapsi.fi

Switch devm_reset_control_array_get() to
devm_reset_control_array_get_exclusive().
Signed-off-by: Ye Xingchen <ye.xingchen@zte.com.cn>
Reviewed-by: Philipp Zabel <p.zabel@pengutronix.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/202303241108553006227@zte.com.cn

Add a new compatible for the thermal sensor device on RK3588 SoCs.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-8-sebastian.reichel@collabora.com

The RK3588 SoC has seven temperature sensor ADC channels:

- Chip Center
- CPU Cluster 1 (Dual A76 "Big" Cores)
- CPU Cluster 2 (Dual A76 "Big" Cores)
- CPU Cluster 0 (Quad A55 "Little" Cores)
- Power Domain Center
- Graphics Processing Unit
- Neural Processing Unit
Signed-off-by: Finley Xiao <finley.xiao@rock-chips.com>
[rebase, squash fixes]
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-7-sebastian.reichel@collabora.com

Dynamically allocate the sensors array based on the amount
of platform sensors in preparation for rk3588 support, which
needs 7 sensors.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-6-sebastian.reichel@collabora.com

Replace the channel ID lookup table by a simple offset, since
the channel IDs are consecutive.
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Link: https://lore.kernel.org/r/20230308112253.15659-5-sebastian.reichel@collabora.com

Use dev_err_probe to simplify error printing in the driver's probe
routine.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-4-sebastian.reichel@collabora.com

By using devm_clk_get_enabled() the clock acquisition and
enabling can be done in one step with automatic error
handling.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-3-sebastian.reichel@collabora.com

It's possible to directly get the match data in a generic
way nowadays.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-2-sebastian.reichel@collabora.com

Pull thermal control material for 6.4-rc1 from Daniel Lezcano:

"- Add more thermal zone device encapsulation: prevent setting
   structure field directly, access the sensor device instead the
   thermal zone's device for trace, relocate the traces in
   drivers/thermal (Daniel Lezcano)

 - Use the generic trip point for the i.MX and remove the get_trip_temp
   ops (Daniel Lezcano)

 - Use the devm_platform_ioremap_resource() in the Hisilicon driver
   (Yang Li)

 - Remove R-Car H3 ES1.* handling as public has only access to the ES2
   version and the upstream support for the ES1 has been shutdown (Wolfram
   Sang)

 - Add a delay after initializing the bank in order to let the time to
   the hardware to initialze itself before reading the temperature
   (Amjad Ouled-Ameur)

 - Add MT8365 support (Amjad Ouled-Ameur)"

* tag 'thermal-v6.4-rc1-1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
  thermal/drivers/ti: Use fixed update interval
  thermal/drivers/stm: Don't set no_hwmon to false
  thermal/drivers/db8500: Use driver dev instead of tz->device
  thermal/core: Relocate the traces definition in thermal directory
  thermal/drivers/hisi: Use devm_platform_ioremap_resource()
  thermal/drivers/imx: Use the thermal framework for the trip point
  thermal/drivers/imx: Remove get_trip_temp ops
  thermal/drivers/rcar_gen3_thermal: Remove R-Car H3 ES1.* handling
  thermal/drivers/mediatek: Add delay after thermal banks initialization
  thermal/drivers/mediatek: Add support for MT8365 SoC
  thermal/drivers/mediatek: Control buffer enablement tweaks
  dt-bindings: thermal: mediatek: Add binding documentation for MT8365 SoC

Once thermal_list_lock has been acquired in
__thermal_cooling_device_register(), it is not necessary to drop it
and take it again until all of the thermal zones have been updated,
so change the code accordingly.

No expected functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Currently the TI thermal driver sets the sensor update interval based
on the polling of the thermal zone. In order to get the polling rate,
the code inspects the thermal zone device structure internals, thus
breaking the self-encapsulation of the thermal framework core
framework.

On the other side, we see the common polling rates set in the device
tree for the platforms using this driver are 500 or 1000 ms.

Setting the polling rate to 250 ms would be far enough to cover the
combination we found in the device tree.

Instead of accessing the thermal zone device structure polling rate,
let's use a common update interval of 250 ms for the driver.

Cc: Keerthy <j-keerthy@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Dhruva Gole <d-gole@ti.com>
Acked-by: Keerthy <j-keerthy@ti.com>
Link: https://lore.kernel.org/r/20230307133735.90772-7-daniel.lezcano@linaro.org

The thermal->tzp->no_hwmon parameter is only used when calling
thermal_zone_device_register().

Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no
effect.

Remove the call and again prevent the drivers to access the thermal
internals.

Cc: Maxime Coquelin <mcoquelin.stm32@gmail.com>
Cc: Alexandre Torgue <alexandre.torgue@foss.st.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230307133735.90772-6-daniel.lezcano@linaro.org

The db8500 driver uses the thermal zone device instead of the device
attached to it. In order to prevent the drivers to access the thermal
zone device structure, replace the thermal zone device by the driver
to show the debug message.

Cc: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Linus Walleij <linus.walleij@linaro.org>
Link: https://lore.kernel.org/r/20230307133735.90772-5-daniel.lezcano@linaro.org

The traces are exported but only local to the thermal core code. On
the other side, the traces take the thermal zone device structure as
argument, thus they have to rely on the exported thermal.h header
file. As we want to move the structure to the private thermal core
header, first we have to relocate those traces to the same place as
many drivers do.

Cc: Steven Rostedt <rostedt@goodmis.org>
Suggested-by: Steven Rostedt <rostedt@goodmis.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Steven Rostedt (Google) <rostedt@goodmis.org>
Link: https://lore.kernel.org/r/20230307133735.90772-2-daniel.lezcano@linaro.org

According to commit 7945f929 ("drivers: provide
devm_platform_ioremap_resource()"), convert platform_get_resource(),
devm_ioremap_resource() to a single call to Use
devm_platform_ioremap_resource(), as this is exactly what this
function does.
Signed-off-by: Yang Li <yang.lee@linux.alibaba.com>
Link: https://lore.kernel.org/r/20230308062719.79522-1-yang.lee@linux.alibaba.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

The thermal framework provides an API to get the trip related to a
trip point id. We want to consolidate the generic trip points code,
thus preventing the different drivers to deal with the trip points
after they registered them.

The set_trip_temp ops will be changed regarding the above changes but
first we need to rework a bit the different implementation in the
drivers.

The goal is to prevent using the trip id but use a trip point passed
as parameter which will contain all the needed information.

As we don't have the trip point passed as parameter yet, we get the
trip point using the generic trip thermal framewrok APIs and use it to
take exactly the same decisions.

The difference with this change and the previous code is from where we
get the thermal trip point (which is the same).

No functional change intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Fabio Estevam <festevam@gmail.com>
Link: https://lore.kernel.org/r/20230309092821.1590586-2-daniel.lezcano@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

The i.MX thermal sensor uses the generic trip points. The thermal
framework can return the critical temperature directly.

Remove the pointless get_trip_temp ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Fabio Estevam <festevam@gmail.com>
Link: https://lore.kernel.org/r/20230309092821.1590586-1-daniel.lezcano@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

R-Car H3 ES1.* was only available to an internal development group and
needed a lot of quirks and workarounds. These become a maintenance
burden now, so our development group decided to remove upstream support
and disable booting for this SoC. Public users only have ES2 onwards.
Reviewed-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230307163041.3815-7-wsa+renesas@sang-engineering.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Thermal sensor reads performed immediately after thermal bank
initialization returns bogus values. This is currently tackled by returning
0 if the temperature is bogus (exceeding 200000).

Instead, add a delay between the bank init and the thermal zone device
register to properly fix this.
Signed-off-by: Michael Kao <michael.kao@mediatek.com>
Signed-off-by: Hsin-Yi Wang <hsinyi@chromium.org>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-5-55a1ae14af74@baylibre.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Merge Intel thermal driver fixes for 6.3-rc5:

 - Fix handling of two recently added module parameters in the Intel
   powerclamp thermal driver (David Arcari).

 - Fix one more deadlock in the int340x thermal driver (Srinivas
   Pandruvada).

* thermal-intel-fixes:
  thermal: intel: powerclamp: Fix cpumask and max_idle module parameters
  thermal: intel: int340x: processor_thermal: Fix additional deadlock

When cpumask is specified as a module parameter the value is
overwritten by the module init routine.  This can easily be fixed
by checking to see if the mask has already been allocated in the
init routine.

When max_idle is specified as a module parameter a panic will occur.
The problem is that the idle_injection_cpu_mask is not allocated until
the module init routine executes. This can easily be fixed by allocating
the cpumask if it's not already allocated.

Fixes: ebf51971 ("thermal: intel: powerclamp: Add two module parameters")
Signed-off-by: David Arcari <darcari@redhat.com>
Reviewed-by: Srinivas Pandruvada<srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

It is preferred to use typed property access functions (i.e.
of_property_read_<type> functions) rather than low-level
of_get_property/of_find_property functions for reading properties. As
part of this, convert of_get_property/of_find_property calls to the
recently added of_property_present() helper when we just want to test
for presence of a property and nothing more.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

For the sake of consistency, revert the second part of the
thermal_hwmon.c hunk from commit dec07d39 ("thermal: Don't use
'device' internal thermal zone structure field") after the first
part of it has been reverted.

Link: https://lore.kernel.org/linux-pm/5b084360-898b-aad0-0b8e-33acc585d71d@linaro.orgSigned-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Commit 52f04f10 ("thermal: intel: int340x: processor_thermal: Fix
deadlock") addressed deadlock issue during user space trip update. But it
missed a case when thermal zone device is disabled when user writes 0.

Call to thermal_zone_device_disable() also causes deadlock as it also
tries to lock tz->lock, which is already claimed by trip_point_temp_store()
in the thermal core code.

Remove call to thermal_zone_device_disable() in the function
sys_set_trip_temp(), which is called from trip_point_temp_store().

Fixes: 52f04f10 ("thermal: intel: int340x: processor_thermal: Fix deadlock")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 6.2+ <stable@vger.kernel.org> # 6.2+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

When the hwmon device node of a thermal zone device is not found,
using hwmon->device causes a kernel NULL pointer dereference.

Fixes: dec07d39 ("thermal: Don't use 'device' internal thermal zone structure field")
Reported-by: Preble Adam C <adam.c.preble@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

The lockdep_assert_held() calls added to cooling_device_stats_setup()
and cooling_device_stats_destroy() by commit 790930f4 ("thermal:
core: Introduce thermal_cooling_device_update()") trigger false-positive
lockdep reports in code paths that are not subject to race conditions
(before cooling device registration and after cooling device removal).

For this reason, remove the lockdep_assert_held() calls from both
cooling_device_stats_setup() and cooling_device_stats_destroy() and
add one to thermal_cooling_device_stats_reinit() that has to be called
under the cdev lock.

Fixes: 790930f4 ("thermal: core: Introduce thermal_cooling_device_update()")
Link: https://lore.kernel.org/linux-acpi/ZCIDTLFt27Ei7+V6@ideak-desk.fi.intel.comReported-by: Imre Deak <imre.deak@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Merge an x86_pkg_temp_thermal Intel thermal driver fix (Zhang Rui).

* thermal-intel:
  thermal: intel: x86_pkg_temp_thermal: Add lower bound check for sysfs input