As per previous changes on thermal framework API,
registering a new thermal zone does not require
a const thermal zone ops.

Thus, this patch removes the flag from imx thermal zone ops.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devicetree@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

This patch is to update thermal zone device after setting emul_temp
in order to make governor work according to input temperature immediately.
Signed-off-by: Lan Tianyu <tianyu.lan@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Having all zero cstate count doesn't necesserily mean the cstate
counter is no functional.
Signed-off-by: Yuxuan Shui <yshuiv7@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal sensor needs pll3_usb_otg when measuring temperature,
otherwise the temperature read will be incorrect, so need to
enable this clk before sensor working, for alarm function,
as hardware will take measurement periodically, so we should
keep this clk always on once alarm function is enabled.
Signed-off-by: Anson Huang <b20788@freescale.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Signed-off-by: Zhang Rui <rui.zhang@intel.com>

As per Documentation/thermal/sysfs-api.txt, max_level
is an index, not a counter. Thus, in case a CPU has
3 valid frequencies, max_level is expected to be 2, for instance.

The current code makes max_level == number of valid frequencies,
which is bogus. This patch fix the cpu_cooling device by
ranging max_level properly.
Reported-by: Carlos Hernandez <ceh@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

This helps increasing build testing coverage.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Acked-by: Simon Horman <horms@verge.net.au>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

To ease debugging thermal problem, add these dynamic debug statements
so that user do not need rebuild kernel to see these info.

Based on a patch from Zhang Rui for debugging on bugzilla:
https://bugzilla.kernel.org/attachment.cgi?id=98671

A sample output after we turn on dynamic debug with the following cmd:
# echo 'module thermal_sys +fp' > /sys/kernel/debug/dynamic_debug/control
is like:

[  355.147627] update_temperature: thermal thermal_zone0: last_temperature=52000, current_temperature=55000
[  355.147636] thermal_zone_trip_update: thermal thermal_zone0: Trip1[type=1,temp=79000]:trend=2,throttle=0
[  355.147644] get_target_state: thermal cooling_device8: cur_state=0
[  355.147647] thermal_zone_trip_update: thermal cooling_device8: old_target=-1, target=-1
[  355.147652] get_target_state: thermal cooling_device7: cur_state=0
[  355.147655] thermal_zone_trip_update: thermal cooling_device7: old_target=-1, target=-1
[  355.147660] get_target_state: thermal cooling_device6: cur_state=0
[  355.147663] thermal_zone_trip_update: thermal cooling_device6: old_target=-1, target=-1
[  355.147668] get_target_state: thermal cooling_device5: cur_state=0
[  355.147671] thermal_zone_trip_update: thermal cooling_device5: old_target=-1, target=-1
[  355.147678] thermal_zone_trip_update: thermal thermal_zone0: Trip2[type=0,temp=90000]:trend=1,throttle=0
[  355.147776] get_target_state: thermal cooling_device0: cur_state=0
[  355.147783] thermal_zone_trip_update: thermal cooling_device0: old_target=-1, target=-1
[  355.147792] thermal_zone_trip_update: thermal thermal_zone0: Trip3[type=0,temp=80000]:trend=1,throttle=0
[  355.147845] get_target_state: thermal cooling_device1: cur_state=0
[  355.147849] thermal_zone_trip_update: thermal cooling_device1: old_target=-1, target=-1
[  355.147856] thermal_zone_trip_update: thermal thermal_zone0: Trip4[type=0,temp=70000]:trend=1,throttle=0
[  355.147904] get_target_state: thermal cooling_device2: cur_state=0
[  355.147908] thermal_zone_trip_update: thermal cooling_device2: old_target=-1, target=-1
[  355.147915] thermal_zone_trip_update: thermal thermal_zone0: Trip5[type=0,temp=60000]:trend=1,throttle=0
[  355.147963] get_target_state: thermal cooling_device3: cur_state=0
[  355.147967] thermal_zone_trip_update: thermal cooling_device3: old_target=-1, target=-1
[  355.147973] thermal_zone_trip_update: thermal thermal_zone0: Trip6[type=0,temp=55000]:trend=1,throttle=1
[  355.148022] get_target_state: thermal cooling_device4: cur_state=0
[  355.148025] thermal_zone_trip_update: thermal cooling_device4: old_target=-1, target=1
[  355.148036] thermal_cdev_update: thermal cooling_device4: zone0->target=1
[  355.169279] thermal_cdev_update: thermal cooling_device4: set to state 1
Signed-off-by: Aaron Lu <aaron.lu@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Add the module device table declaration so the module can be loaded
automatically at boot time.
Signed-off-by: Russell King <rmk+kernel@arm.linux.org.uk>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Mark function sys_set_trip_temp() as static in x86_pkg_temp_thermal.c
because it is not used outside this file.

This eliminates the following warning in x86_pkg_temp_thermal.c:
drivers/thermal/x86_pkg_temp_thermal.c:218:5: warning: no previous prototype for ‘sys_set_trip_temp’ [-Wmissing-prototypes]
Signed-off-by: Rashika Kheria <rashika.kheria@gmail.com>
Reviewed-by: Josh Triplett <josh@joshtriplett.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

This patch fixes a compilation warning.

warning: passing argument 5 of 'thermal_zone_device_register' discards 'const'
qualifier from pointer target type [enabled by default]
include/linux/thermal.h:270:29: note: expected 'struct thermal_zone_device_ops *'
but argument is of type 'const struct thermal_zone_device_ops *'
Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Fixes regression introduced by:

commit 37713a1e
Author: Philipp Zabel <p.zabel@pengutronix.de>
Date:   Thu Aug 1 18:33:12 2013 +0200

    thermal: imx: implement thermal alarm interrupt handling

The commit 37713a1e makes imx thermal sensor always powered up as alarm
function is enabled, but the suspend callback of imx thermal returns
success only if thermal sensor is powered down, so it will always returns
fail hence break system's suspend, this patch disables imx thermal sensor
before suspend and re-enable it after resume.
Signed-off-by: Anson Huang <b20788@freescale.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Set the return variable to an error code as done elsewhere in the function.

A simplified version of the semantic match that finds this problem is as
follows: (http://coccinelle.lip6.fr/)

// <smpl>
(
if@p1 (\(ret < 0\|ret != 0\))
 { ... return ret; }
|
ret@p1 = 0
)
... when != ret = e1
    when != &ret
*if(...)
{
  ... when != ret = e2
      when forall
 return ret;
}

// </smpl>
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Reviewed-by: Jingoo Han <jg1.han@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

The ACPI INT3403 device objects present on some systems can be used to retrieve
temperature data from thermal sensors. Add a driver registering each INT3403
device object as a thermal zone device and exposing its _TMP, PATx and GTSH
method via the standard thermal control interface under /sys/class/thermal/.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into soc-thermal

After discussion and agreement of thermal device tree bindings,
it is desirable to properly maintain thermal bindings for
existing and upcoming devices.

As original author of thermal device tree bindings, I am
volunteering to maintain them. This then adds and entry
for device tree bindings under thermal domain.

Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Pawel Moll <pawel.moll@arm.com>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

Small fix on representation. Bandgap node belongs to OCP.

Cc: "Benoît Cousson" <bcousson@baylibre.com>
Cc: Tony Lindgren <tony@atomide.com>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Pawel Moll <pawel.moll@arm.com>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Russell King <linux@arm.linux.org.uk>
Cc: linux-omap@vger.kernel.org
Cc: devicetree@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Suggested-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

Small fix on representation. Bandgap node belongs to OCP.

Cc: "Benoît Cousson" <bcousson@baylibre.com>
Cc: Tony Lindgren <tony@atomide.com>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Pawel Moll <pawel.moll@arm.com>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Russell King <linux@arm.linux.org.uk>
Cc: linux-omap@vger.kernel.org
Cc: devicetree@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Suggested-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

OMAP5 devices can reach high temperatures and thus
needs to have cpufreq-cooling on systems running on it.

This patch adds the required cooling device properties
so that cpufreq-cpu0 driver loads the cooling device.

Cc: "Benoît Cousson" <bcousson@baylibre.com>
Cc: Tony Lindgren <tony@atomide.com>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Pawel Moll <pawel.moll@arm.com>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Ian Campbell <ian.campbell@citrix.com>
Cc: Russell King <linux@arm.linux.org.uk>
Cc: linux-omap@vger.kernel.org
Cc: devicetree@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

This patch changes the dtsi entry on omap5 to contain
the thermal data. This data will enable the passive
cooling with CPUfreq cooling device at 100C. The
system will do a thermal shutdown at 125C whenever
any of its sensors sees this level.

Cc: "Benoît Cousson" <bcousson@baylibre.com>
Cc: Tony Lindgren <tony@atomide.com>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Pawel Moll <pawel.moll@arm.com>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Ian Campbell <ian.campbell@citrix.com>
Cc: Russell King <linux@arm.linux.org.uk>
Cc: linux-omap@vger.kernel.org
Cc: devicetree@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

This patch changes a dtsi file to contain the thermal data
for CORE domain on OMAP5 and later SoCs. This data will
enable a thermal shutdown at 125C.

This thermal data can be reused across TI SoC devices.

Cc: "Benoît Cousson" <bcousson@baylibre.com>
Cc: Tony Lindgren <tony@atomide.com>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Pawel Moll <pawel.moll@arm.com>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Ian Campbell <ian.campbell@citrix.com>
Cc: Russell King <linux@arm.linux.org.uk>
Cc: linux-omap@vger.kernel.org
Cc: devicetree@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

This patch changes a dtsi file to contain the thermal data
for GPU domain on OMAP5 and later SoCs. This data will
enable a thermal shutdown at 125C.

This thermal data can be reused across TI SoC devices.

Cc: "Benoît Cousson" <bcousson@baylibre.com>
Cc: Tony Lindgren <tony@atomide.com>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Pawel Moll <pawel.moll@arm.com>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Ian Campbell <ian.campbell@citrix.com>
Cc: Russell King <linux@arm.linux.org.uk>
Cc: linux-omap@vger.kernel.org
Cc: devicetree@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

OMAP4460 devices can reach high temperatures and thus
needs to have cpufreq-cooling on systems running on it.

This patch adds the required cooling device properties
so that cpufreq-cpu0 driver loads the cooling device.

Cc: "Benoît Cousson" <bcousson@baylibre.com>
Cc: Tony Lindgren <tony@atomide.com>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Pawel Moll <pawel.moll@arm.com>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Ian Campbell <ian.campbell@citrix.com>
Cc: Russell King <linux@arm.linux.org.uk>
Cc: linux-omap@vger.kernel.org
Cc: devicetree@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

OMAP4430 devices can reach high temperatures and thus
needs to have cpufreq-cooling on systems running on it.

This patch adds the required cooling device properties
so that cpufreq-cpu0 driver loads the cooling device.

Cc: "Benoît Cousson" <bcousson@baylibre.com>
Cc: Tony Lindgren <tony@atomide.com>
Cc: Russell King <linux@arm.linux.org.uk>
Cc: linux-omap@vger.kernel.org
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

This patch changes the dtsi entry on omap4460 to contain
the thermal data. This data will enable the passive
cooling with CPUfreq cooling device at 100C and the
system will do a thermal shutdown at 125C.

Cc: "Benoît Cousson" <bcousson@baylibre.com>
Cc: Tony Lindgren <tony@atomide.com>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Pawel Moll <pawel.moll@arm.com>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Ian Campbell <ian.campbell@citrix.com>
Cc: Russell King <linux@arm.linux.org.uk>
Cc: linux-omap@vger.kernel.org
Cc: devicetree@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

This patch changes the dtsi entry on omap4430 to contain
the thermal data. This data will enable the passive
cooling with CPUfreq cooling device at 100C and the
system will do a thermal shutdown at 125C.

Cc: "Benoît Cousson" <bcousson@baylibre.com>
Cc: Tony Lindgren <tony@atomide.com>
Cc: Russell King <linux@arm.linux.org.uk>
Cc: linux-omap@vger.kernel.org
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

This patch changes a dtsi file to contain the thermal data
for MPU domain on OMAP4 and later SoCs. This data will
enable the passive cooling with CPUfreq cooling device
at 100C and the system will do a thermal shutdown at 125C.

This thermal data can be reused across TI SoC devices.

Cc: "Benoît Cousson" <bcousson@baylibre.com>
Cc: Tony Lindgren <tony@atomide.com>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Pawel Moll <pawel.moll@arm.com>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Ian Campbell <ian.campbell@citrix.com>
Cc: Russell King <linux@arm.linux.org.uk>
Cc: linux-omap@vger.kernel.org
Cc: devicetree@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

This patch improves the ti-soc-thermal driver by adding the
support to build the thermal zones based on DT nodes.

The driver will have two options now to build the thermal
zones. The first option is the zones originally coded
in this driver. So, the driver behavior will be same
if there is no DT node describing the zones. The second
option, when it is found a DT node with thermal data,
will used the common infrastructure to build the thermal
zone and bind its cooling devices.

In case the driver loads thermal data using the legacy
mode, this driver still adds to the system
a cpufreq cooling device. Loading the thermal data from
DT, the driver assumes someone else will add the cpufreq
cooling device, like the cpufreq driver.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

This patch adds to tmp102 temperature sensor the possibility
to expose itself as thermal zone device, registered on the
thermal framework.

The thermal zone is built only if a device tree node
describing a thermal zone for this sensor is present
inside the tmp102 DT node. Otherwise, the driver behavior
will be the same.

Note: This patch has also been reviewed by Jean D. He has
requested to perform a wider inspection of possible
users of thermal and hwmon interaction API. On the other
hand, the change on this patch is acceptable on first
step of overall code change.

Cc: Jean Delvare <khali@linux-fr.org>
Cc: lm-sensors@lm-sensors.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

This patch adds to lm75 temperature sensor the possibility
to expose itself as thermal zone device, registered on the
thermal framework.

The thermal zone is built only if a device tree node
describing a thermal zone for this sensor is present
inside the lm75 DT node. Otherwise, the driver behavior
will be the same.

Note: This patch has also been reviewed by Jean D. He has
requested to perform a wider inspection of possible
users of thermal and hwmon interaction API. On the other
hand, the change on this patch is acceptable on first
step of overall code change.

Cc: Jean Delvare <khali@linux-fr.org>
Cc: lm-sensors@lm-sensors.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

This patch changes the cpufreq-cpu0 driver to consider if
a cpu needs cooling (with cpufreq). In case the cooling is needed,
the cpu0 device tree node needs to be properly configured
with cooling device properties.

In case these properties are present,, the driver will
load a cpufreq cooling device in the system. The cpufreq-cpu0
driver is not interested in determining how the system should
be using the cooling device. The driver is responsible
only of loading the cooling device.

Describing how the cooling device will be used can be
accomplished by setting up a thermal zone that references
and is composed by the cpufreq cooling device.

Cc: "Rafael J. Wysocki" <rjw@sisk.pl>
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: cpufreq@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devicetree-discuss@lists.ozlabs.org
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

This patch introduces an API to register cpufreq cooling device
based on device tree node.

The registration via device tree node differs from normal
registration due to the fact that it is needed to fill
the device_node structure in order to be able to match
the cooling devices with trip points.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

This patch adds a new API to allow registering cooling devices
in the thermal framework derived from device tree nodes.

This API links the cooling device with the device tree node
so that binding with thermal zones is possible, given
that thermal zones are pointing to cooling device
device tree nodes.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

This patch changes the thermal core driver to allow
registration of thermal zones without the .get_temp callback.

The idea behind this change is to allow lazy registration
of sensor callbacks.

The thermal zone will be disabled whenever the ops
does not contain a .get_temp callback. The sysfs interface
will be returning -EINVAL on any temperature read operation.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

Merge branch 'leds-fixes-for-3.13' of git://git.kernel.org/pub/scm/linux/kernel/git/cooloney/linux-leds

Pull LED subsystem bugfix from Bryan Wu.

* 'leds-fixes-for-3.13' of git://git.kernel.org/pub/scm/linux/kernel/git/cooloney/linux-leds:
  leds: pwm: Fix for deferred probe in DT booted mode

We need to make sure that the error code from devm_of_pwm_get() is the one
the module returns in case of failure.
Restructure the code to make this possible for DT booted case.
With this patch the driver can ask for deferred probing when the board is
booted with DT.
Fixes for example omap4-sdp board's keyboard backlight led.
Signed-off-by: Peter Ujfalusi <peter.ujfalusi@ti.com>
Signed-off-by: Bryan Wu <cooloney@gmail.com>